Parallel Moving 3D RF Sputtering Device 'MSS600-3'
Control of sputter pressure is possible with gas introduction and pressure control valves!
The "MSS600-3" is a three-dimensional RF sputtering device using a rectangular cathode measuring W100 x H500mm. The substrate size is W200 x H300mm, and it is deposited while being transported in the X direction. Additionally, the substrate can be set to any time between 30 seconds and 15 hours, allowing for film thickness adjustment and various types of heterogeneous layered film deposition. 【Features】 ■ Automatic sputtering function enables labor-saving long-duration sputtering work. ■ Uses a rectangular cathode manufactured by GenCore, allowing for uniform sputter gas introduction near the target. ■ The process chamber is divided into three rooms with rotating shutters to prevent sputter contamination diffusion. ■ Sputtering is possible while moving the substrate at a constant speed, among other features. *For more details, please download the PDF or feel free to contact us.
- Company：愛知真空
- Price：Other
